Description

HEPCO, Inc. has designed and built component lead forming equipment in its Sunnyvale, California facility since the early 1970's. Working with some of the world's largest sub-contract assemblers and OEMs here in the fast-paced Silicon Valley environment places HEPCO in a unique position in the industry. Our vast client list encompasses the smallest start-up companies to the largest in EMS, aerospace and semiconductor manufacturing, for whom we provide lead forming solutions from single-stroke forming to bowl-fed systems.

HEPCO has recently expanded its line to include PCB de-paneling equipment for routed PCBs. Also introduced is a new BGA Sphere Placement System which uses vacuum pick-up and placement of spheres for an entire array at once, and provides a mechanically-correct method of bumping or reballing BGA components.

HEPCO Products

1500-1 Radial Lead Trimming Machine

Bowl-Fed Bowl Feeder System

1700-2 Radial Lead Trimming Machine (.500" & 15mm Perforated Tape)

1800-1 Radial Lead Forming & Cutting Machine (for Taped Components)

3000-2 Manual Lead Forming & Cutting  Machine

T3700-2 Radial Lead Shear Machine

6500-1 Universal Lead Forming & Cutting Machines

DIP Lead Cutters

DIP Lead Formers

8000-1 Axial Lead Former

HEPCO Products Target Markets

Russia, United States, Saudi Arabia, India, Pakistan, Indonesia, Thailand, UK, Braizil and more.